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Ship the Chip print | email |
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(Full teacher resource documents are included in the PDF)
Lesson Focus
Lesson focuses on engineering package designs that meet the needs of safely shipping a product. Students work in teams of "engineers" to design a package using standard materials that will safely ship a single chip through the mail to the school address.
Lesson Synopsis
The Ship the Chip lesson not only explores how engineers develop packaging design requirements, but also evaluates the external stresses that engineers must consider when developing a package or product design. Students work as teams of engineers, evaluating material selection, manufacturing, testing and evaluation of their package design
Age Levels: 8-18
Objectives
- Learn about engineering product planning and design.
- Learn about meeting the needs of society.
- Learn about teamwork and working in groups
Anticipated Learner Outcomes
As a result of this activity, students should develop an understanding of:
- Package design planning and testing
- problem solving
- teamwork
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Lesson Activities
Students learn how engineers develop packaging design requirements, and work in a team to evaluate the external stresses that engineers must consider when developing a package or product design. Students develop a plan, select materials, manufacture their package, test it, and evaluate their results. Student teams present their reflections to the class.
Resources/Materials
- Teacher Resource Documents (attached)
- Student Worksheets (attached)
- Student Resource Sheets (attached)
Alignment to Curriculum Frameworks
Curriculum alignment sheet is included in PDF.
Categories
Engineering Design, Properties Of Materials
Take Survey
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